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LPDDR4 Selection Guide: Part Number and Naming Rules Explained -Samunsg,SK Hynix,Micron
Many customers and R&D teams struggle to distinguish part numbers and naming conventions across different Memory products. I have compiled commonly‑used memory components available on the market as a reference for hardware engineers and digital enthusiasts.
In smartphones, tablets and low‑power devices, LPDDR4 SDRAM has become the mainstream solution thanks to its high bandwidth and low‑power characteristics. However, complex part‑number naming schemes from vendors including Samsung, Micron and SK Hynix often confuse users and practitioners.
This article provides an in‑depth breakdown of LPDDR4 die naming rules, vendor‑specific technical features and practical component‑selection guidelines covering six major manufacturers. It will help you master the underlying logic and quickly build practical part‑selection skills.
1. Samsung
As the global leader in the DRAM market, Samsung’s LPDDR4 components start with the prefix K4F, featuring a 16‑character coding scheme. The core rules are defined below:
First three characters:
K4: DRAM die identifier
F: Stands for LPDDR4X SDRAM
4th‑5th character: Density indicator. Example:
6E: 16 Gb, 8K / 32 ms
6th‑7th character: Data bus width. For instance, 3s denotes a 32‑bit interface.
8th character: Bank configuration; the digit 4 represents an 8‑Bank design.
9th character: Interface voltage specification.
10th character: Product generation identifier.
Suffix codes:
M: Package type (e.g. FBGA)
G: Temperature and power‑rating class
CJ: Performance grade and batch code
2. Micron
Micron LPDDR4 parts use the MT53E prefix, built exclusively for the LPDDR4 standard. Example part number: MT53E512M32D2NP‑046 WT:E
MT53E: LPDDR4 family identifier and operating voltage grade
512M: 512 Mb per die (equivalent to 64 MB)
32: 32‑bit data width
D2: Addressing scheme and die count (D2 = 2‑die configuration)
DS: Package code; DS refers to a 300‑ball WFBGA package
046: Timing parameter; 046 corresponds to 468 ps at 2133 MHz (4266 Mbps effective data rate)
WT:E: Package site and batch code (WT denotes Taiwan packaging facility)
3. SK Hynix
SK Hynix LPDDR4 dies begin with the identifier H9. Example part number: H9HC4GXXXXX
H5: DRAM product‑line marker
TC4G: 4 Gb density (TC = Mobile LPDDR4)
63C: 32‑bit bus width (internal vendor code)
FR: Frequency and timing bin; FR corresponds to 1600 MHz with 14‑14‑14 timings
PBA: FBGA package and batch identifier
Performance grading:
CJR (H5AN8G8NCJR): High compatibility for general‑purpose designs
DJR (H5ANAG6NCJR): Better overclocking headroom for performance‑oriented applications
4. Nanya
Nanya LPDDR4 components carry NT6 or NT5 as the leading prefix. Example: NT6CL512T32BP‑H1
NT6: LPDDR4 product family
CL: Consumer‑grade; IL stands for industrial‑grade
512T: 512 Mb die density
32: 32‑bit bus width
BP‑H1: Package and speed bin (H1 = 1600 MHz)
Market positioning: Nanya DRAM delivers cost‑effective performance with limited overclocking capability, suited for entry‑level cost‑sensitive devices.
5. CXMT (ChangXin Memory Technologies)
As China’s domestic DRAM flagship vendor, CXMT LPDDR4 parts start with the CX prefix. Example: CXDB5CCAM‑ML
CX: Proprietary CXMT die marker
DB: DRAM LPDDR4X designation
5: Density specification: 32 Gb
C: Package type, 200‑ball FBGA
C: Memory configuration: 32‑bit, dual‑channel, 2‑Chip‑Select
Suffix L: Speed‑grade code (e.g. 2133 MHz / 4266 Mbps)
Key advantages: Competitive pricing and stable supply chain, qualified by mainstream OEM device manufacturers.
6. Kioxia
No valid public datasheet information is available for Kioxia (formerly Toshiba Storage) LPDDR4 memory devices.
Conclusion
Understanding die naming conventions is like obtaining a “selection cipher book”. Whether you opt for Samsung D‑die for ultimate performance or domestic CXMT components for local‑supply designs, the correct memory selection maximises your hardware potential. Going forward, as LPDDR5X and LPDDR6 gain market adoption, these coding rules will continue to evolve — yet the fundamental evaluation criteria remain unchanged: density, bandwidth and reliability form the eternal performance triangle.
Note:
Certain part numbers may contain vendor‑specific custom variations. Always refer to the official datasheet for final specifications.
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About RichPower Technology
RichPower Technology is a comprehensive professional supplier of storage and semiconductor total solutions. Our product portfolio
includes high-grade LPDDR memory ICs, embedded flash storage (eMMC / eMCP), Western Digital enterprise hard disk drives and
SiC power modules. TF card,We deliver full professional technical consulting and stable component supply solutions targeting industrial
automation, automotive electronics and global IoT system manufacturers.
If you are evaluating LPDDR vendors for embedded or industrial hardware projects, RichPower can provide one-stop support covering
component model selection, mass procurement and cross-reference alternative chip matching.
